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Deposition Equipment Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 01, 2025～Oct 28, 2025
This ranking is based on the number of page views on our site.

Deposition Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 01, 2025～Oct 28, 2025
This ranking is based on the number of page views on our site.

  1. ワッティー Tokyo//Industrial Electrical Equipment
  2. 昭和真空 Kanagawa//Industrial Machinery
  3. ハイテック・システムズ Kanagawa//Industrial Machinery
  4. 4 エイチ・ティー・エル HTL（エイチティーエル） Tokyo//Industrial Machinery
  5. 4 ALDジャパン Tokyo//Trading company/Wholesale
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Deposition Equipment Product ranking

Last Updated： Aggregation Period:Oct 01, 2025～Oct 28, 2025
This ranking is based on the number of page views on our site.

  1. Contract film deposition service for experimental and research development purposes: "ALD (Atomic Layer Deposition) Equipment" ワッティー
  2. Atomic Layer Deposition Device "ALD-Series" 昭和真空
  3. Thermal ALD (Atomic Layer Deposition) equipment ハイテック・システムズ
  4. Tabletop thermal / plasma-assisted atomic layer deposition (ALD) device エイチ・ティー・エル HTL（エイチティーエル）
  5. 4 Atomic Layer Deposition (ALD) device ALDジャパン

Deposition Equipment Product List

1～11 item / All 11 items

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Thermal ALD (Atomic Layer Deposition) equipment

Thermal ALD (Atomic Layer Deposition) equipment

ALD device. Compact and low-cost, achieving precise thickness with atomic-level deposition control!

High-Tech Systems is the sales agent for Veeco/CNT, a global leading company in ALD (Atomic Layer Deposition) equipment. Veeco/CNT is the ALD (Atomic Layer Deposition) division of the U.S. company Veeco, which develops advanced ALD technology and is the manufacturer of the most widely used development and pilot production ALD equipment in research institutions, universities, and companies around the world. They also have a proven track record in the market for production ALD equipment and large-area substrate ALD equipment, and they respond to customer requests.

  • Other processing machines

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PED device "Pioneer 180 PED System"

PED device "Pioneer 180 PED System"

Quickly evaporate the target material with a high-energy pulsed electron beam! It is possible to form films of all solid materials.

The "Pioneer 180 PED System" is a PED (Pulsed Electron Deposition) device that, like PLD, enables the formation of thin films with complex physical properties for various devices using the pulsed electron deposition method. With a high-energy pulsed electron beam (pulse width of 80-100 ns, <1000A, 15kV), it is capable of rapidly evaporating the target material, allowing for the deposition of all solid materials. The substrate size can accommodate diameters from 10mm to 2 inches, and the substrate can be heated up to 850°C using radiant heating. 【Features】 ■ The pulsed electron deposition method allows for the formation of thin films with complex physical properties for various devices, similar to PLD. ■ The high-energy pulsed electron beam (pulse width of 80-100 ns, <1000A, 15kV) enables rapid evaporation of the target material, allowing for the deposition of all solid materials. *For more details, please refer to the PDF document or feel free to contact us.

  • Heating device

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Electrode deposition device "VK-PUM-1010×4"

Electrode deposition device "VK-PUM-1010×4"

Production speed is 2 modules per minute (curing time 2 minutes)! The maximum weight of the block is 1.2 kilograms.

We would like to introduce our automatic electrode stacking and deposition device, 'VK-PUM-1010×4', for flexible DSC production. The loading method involves automatically picking up the upper electrode from the loading tray. Approximately 135 sheets (when the sheet thickness is 0.2mm) can be loaded onto the tray, while the lower electrode is manually loaded onto the hot plate by the user. The unloading method automatically unloads the completed modules onto the unloading tray, which can accommodate about 70 modules (when the module thickness is 0.4mm). 【Technical Specifications (Partial)】 ■ Electrode pickup method: Vacuum pads (4), recommended maximum operating temperature for rubber pads is 200℃ ■ Vacuum levels for weight blocks and flexible electrode sheets - For weight blocks: Complete vacuum level of the pump - For flexible electrodes: The vacuum level can be reduced by rotating two flow control valves until the deformation of the electrodes is eliminated. *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Atomic Layer Deposition (ALD) device

Atomic Layer Deposition (ALD) device

A very compact atomic layer deposition device with a rich process recipe.

Compact tabletop ALD. It can be used for various device development such as surface protection and modification by film formation on semiconductor devices, organic solar cells, nanowires, quantum dots, and more. The process has been developed at a material development base for ALD and CVD. We are continuously increasing the recipes and also accept new process development requests.

  • CVD Equipment
  • Other surface treatment equipment

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Atomic Layer Deposition Device "ALD-Series"

Atomic Layer Deposition Device "ALD-Series"

It is ideal for film formation on substrates with complex shapes and can also accommodate resin substrates with low-temperature film formation. Additionally, it produces thin films with excellent gas barrier properties.

ALD (Atomic Layer Deposition) is a method for film formation that deposits a single atomic layer in one cycle, forming a thin film by repeating the cycles. It enables uniform layer control at the atomic layer level, allowing for the formation of high-quality thin films with excellent step coverage. 【Features】 ○ Ideal for film deposition on complex-shaped substrates ○ Compatible with resin substrates due to low-temperature deposition ○ Thin films with excellent gas barrier properties can be obtained For more details, please contact us or download the catalog.

  • Vacuum Equipment
  • Other semiconductor manufacturing equipment

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Atomic Layer Deposition Device "AFALD-8"

Atomic Layer Deposition Device "AFALD-8"

Excellent step coverage and precise film thickness control! High-quality film formation is possible.

The "AFALD-8" is an atomic layer deposition device that enables film formation with atom-level thickness control on complex three-dimensional structures. It allows for high-quality thin film deposition in milliseconds, achieving stable film formation with low damage. It features user-friendly software and highly flexible configuration options. 【Features】 ■ Step coverage ■ High precision thickness control ■ Pinhole-free ■ Low damage ■ Reduced raw material costs *For more details, please refer to the catalog or feel free to contact us.

  • Other machine elements
  • Other semiconductor manufacturing equipment

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Circuit formation: ALD (Atomic Layer Deposition)

Circuit formation: ALD (Atomic Layer Deposition)

Reliability and quality of Dublin you can count on! Capable of manufacturing conductive and insulating material coatings.

We would like to introduce our semiconductor circuit formation technology, "ALD (Atomic Layer Deposition)." Semiconductors are precision-finished products designed to exhibit high accuracy and optimal performance. With ALD (Atomic Layer Deposition), we can produce thin films of conductive or insulating materials that are uniformly coated with nanometer-sized structures. [Features] ■ Production of thin films uniformly coated with nanometer-sized structures *For more details, please refer to the related links or feel free to contact us.

  • Other semiconductors

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Contract film deposition service for experimental and research development purposes: "ALD (Atomic Layer Deposition) Equipment"

Contract film deposition service for experimental and research development purposes: "ALD (Atomic Layer Deposition) Equipment"

Assistance with film formation on various samples using the requested precursor. Capable of live demonstrations, comparative evaluations based on parameters, and film thickness measurements.

At Watty, we offer a "contract film deposition service" using ALD equipment. We can deposit various oxide and nitride films such as Al2O3, TiO2, ZrO2, HfO2, RuO2, SiO2, and TiN. The sizes we can accommodate range from small chips to pipes and films, up to 300mm. We respond to various needs, including assistance with film deposition on various samples using your desired precursors, live demonstrations with customer attendance, and evaluations based on your preferred recipes and parameters. ★ If you would like to know more about our services or are considering making a request, please feel free to contact us using the "Contact Us" button below. 【Features】 ■ Capable of depositing various oxide and nitride films (Al2O3, TiO2, ZrO2, HfO2, RuO2, SiO2, TiN, etc.) ■ Can accommodate sizes from small chips to pipes and films, up to 300mm ■ Our technicians provide support for recipe creation and parameter settings ■ We can also accommodate the use of your own precursors ■ Regular small-lot production is possible *For more details, please refer to the PDF document or feel free to contact us.

  • Other surface treatment equipment

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Spray Pyrolysis Deposition Device "KV-100"

Spray Pyrolysis Deposition Device "KV-100"

Control all functions remotely! Save an unlimited number of recipes on your computer.

The "KV-100" is a spray thermal decomposition deposition device equipped with an exhaust pump that has a 50mm exhaust diameter and a powder filter. The spray nozzle is mounted on an electric XY stage, utilizing a special spray line pattern to produce a uniform film. With the liquid supply system equipped with an automatic syringe pump, users can set the initial parameters for precise spray speed and total liquid amount. 【Special Features】 ■ Movable spray nozzle ■ Spray amount control ■ Remote control operation *For more details, please refer to the PDF document or feel free to contact us.

  • Other physicochemical equipment

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Spray Pyrolysis Deposition Device "KV-25 II"

Spray Pyrolysis Deposition Device "KV-25 II"

Air source pressure is 0.6 MPa or higher! The exhaust system is equipped with an exhaust pump with a powder filter.

The "KV-25 II" is a spray thermal decomposition deposition device that allows for easy setting of operation parameters using a keypad and LCD. The spray nozzle is mounted on an electric stage and moves in a circular path to expand the uniform application area. Additionally, it can be controlled using the onboard keypad and LCD, or connected to a computer via Bluetooth. 【Features】 ■ Mobile spray nozzle ■ User interface *For more details, please refer to the PDF document or feel free to contact us.

  • Other physicochemical equipment

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Tabletop thermal / plasma-assisted atomic layer deposition (ALD) device

Tabletop thermal / plasma-assisted atomic layer deposition (ALD) device

Arradiance's tabletop ALD device can be equipped with a plasma unit despite being a tabletop model, and it is capable of film deposition not only for oxide films but also for nitrides, Pt, and Ru.

Despite being a compact tabletop ALD device, it enables atomic-level layer deposition. There is also a PEALD device equipped with a plasma unit. It can deposit on structures with a diameter of up to 200mm and a height of 25mm, as well as on carbon nanotubes (CNT) and graphene. In addition to oxide films, it also supports the deposition of nitrides and metals such as Pt and Ru. It features a 300W air-cooled direct ICP plasma head with four mass flow controlled plasma and gas inputs, and a reactor temperature adjustable up to 300°C. It includes a material supply pressurization assist function for low vapor pressure applications. The sample stage can accommodate substrates up to 200mm in diameter, and a 450°C heated stage is also available. The Arradiance GEMFlow software is user-friendly and allows for easy creation of deposition recipes. It controls all major operational parameters, including temperature, gas flow, high-speed ALD valves, RF power, and vacuum isolation. A diagnostic system and logs enable tracking of all system parameters during operation. Regarding RGIP (Reactor Gas Injection Protocol), it is equipped with a gas port monitoring interlock function.

  • Other surface treatment equipment

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